Granted Patent
Utility
US 6,726,780 · App. 10/384,829
Lead-free solder, and paste solder composition
Inventors:
Takao Ono, Mitsuru Iwabuchi, Kenji Fujimori, Hiroaki Koyahara
Patented Case
View Patent ↗
Granted: Apr 27, 2004
Filed: Mar 10, 2003
Inventors
Takao Ono
Mitsuru Iwabuchi
Kenji Fujimori
Hiroaki Koyahara
Assignee (at issue)
TAMURA KAKEN CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.