Granted Patent
Utility
US 6,729,950 · App. 10/129,386
Chemical mechanical polishing pad having wave shaped grooves
Inventors:
Inha Park, Tae-Kyoung Kwon, Jaeseok Kim, In-Ju Hwang
Patented Case
View Patent ↗
Granted: May 4, 2004
Filed: May 3, 2002
Inventors
Inha Park
Tae-Kyoung Kwon
Jaeseok Kim
In-Ju Hwang
Assignee (at issue)
SKC CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.