Granted Patent
Utility
US 6,734,556 · App. 10/088,163
Semiconductor device with chip-on-chip construction joined via a low-melting point metal layer
Inventor:
Kazutaka Shibata
Patented Case
View Patent ↗
Granted: May 11, 2004
Filed: Mar 15, 2002
Inventor
Kazutaka Shibata
Assignee (at issue)
ROHM CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.