IP Library Granted Patent US 6,749,488
Granted Patent Utility
US 6,749,488 · App. 10/268,254

Chemical mechanical polishing slurry composition for polishing conductive and non-conductive layers on semiconductor wafers

Inventors: Anthony M. Pasqualoni, Deepak Mahulikar, Larry LaFollette, Richard Jenkins
Patented Case View Patent ↗
Granted: Jun 15, 2004 Filed: Oct 9, 2002
Inventors
Anthony M. Pasqualoni
Deepak Mahulikar
Larry LaFollette
Richard Jenkins
Assignee (at issue)
Planar Solutions, LLC

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Quick Facts
Patent No.
US 6,749,488
App. No.
10/268,254
Filed
2002-10-09
Granted
2004-06-15
Kind
B2