Granted Patent
Utility
US 6,752,888 · App. 10/012,425
Mounting and curing chips on a substrate so as to minimize gap
Inventors:
Paul A. Hosier, Kraig A. Quinn
Patented Case
View Patent ↗
Granted: Jun 22, 2004
Filed: Dec 12, 2001
Inventors
Paul A. Hosier
Kraig A. Quinn
Assignee (at issue)
Xerox Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.