IP Library › Granted Patent US 6,754,407
Granted Patent Utility
US 6,754,407 · App. 10/158,250

Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board

Inventors: Kishore K. Chakravorty, Johanna M. Swan, Brandon Barnett, Joseph F. Ahadian, Thomas P. Thomas, Ian A. Young
Patented Case View Patent ↗
Granted: Jun 22, 2004 Filed: May 30, 2002
Inventors
Kishore K. Chakravorty
Johanna M. Swan
Brandon Barnett
Joseph F. Ahadian
Thomas P. Thomas
Ian A. Young
Assignee (at issue)
Intel Corporation

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Quick Facts
Patent No.
US 6,754,407
App. No.
10/158,250
Filed
2002-05-30
Granted
2004-06-22
Kind
B2