IP Library › Granted Patent US 6,755,719
Granted Patent Utility
US 6,755,719 · App. 10/385,185

End surface polishing device and end surface polishing method

Inventors: Kisaburou Yoshida, Kouji Minami
Patented Case View Patent ↗
Granted: Jun 29, 2004 Filed: Mar 10, 2003
Inventors
Kisaburou Yoshida
Kouji Minami
Assignee (at issue)
SEIKO INSTRUMENTS INC.

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Quick Facts
Patent No.
US 6,755,719
App. No.
10/385,185
Filed
2003-03-10
Granted
2004-06-29
Kind
B2