Granted Patent
Utility
US 6,759,323 · App. 09/793,345
Method for filling depressions in a surface of a semiconductor structure, and a semiconductor structure filled in this way
Inventor:
Markus Kirchhoff
Patented Case
View Patent ↗
Granted: Jul 6, 2004
Filed: Feb 26, 2001
Inventor
Markus Kirchhoff
Assignee (at issue)
Infineon Technologies AG
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.