Granted Patent
Utility
US 6,759,597 · App. 09/017,338
Wire bonding to dual metal covered pad surfaces
Inventors:
Lawrence R. Cutting, John G. Gaudiello, Luis J. Matienzo, Nikhil M. Murdeshwar
Patented Case
View Patent ↗
Granted: Jul 6, 2004
Filed: Feb 2, 1998
Inventors
Lawrence R. Cutting
John G. Gaudiello
Luis J. Matienzo
Nikhil M. Murdeshwar
Assignee (at issue)
International Business Machines Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.