Granted Patent
Utility
US 6,772,512 · App. 09/760,439
Method of fabricating a flip-chip ball-grid-array package without causing mold flash
Inventors:
Ying-Chou Tsai, Jen-Yi Tsai
Patented Case
View Patent ↗
Granted: Aug 10, 2004
Filed: Jan 13, 2001
Inventors
Ying-Chou Tsai
Jen-Yi Tsai
Assignee (at issue)
SILICONWARE PRECISION INDUSTRIES CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.