Granted Patent
Utility
US 6,777,331 · App. 10/225,920
Multilayered copper structure for improving adhesion property
Inventor:
Tue Nguyen
Patented Case
View Patent ↗
Granted: Aug 17, 2004
Filed: Aug 23, 2002
Inventor
Tue Nguyen
Assignee (at issue)
Simplus Systems Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.