Granted Patent
Utility
US 6,777,777 · App. 10/447,397
High density composite MIM capacitor with flexible routing in semiconductor dies
Inventors:
Arjun Kar-Roy, Marco Racanelli, Paul Kempf
Patented Case
View Patent ↗
Granted: Aug 17, 2004
Filed: May 28, 2003
Inventors
Arjun Kar-Roy
Marco Racanelli
Paul Kempf
Assignee (at issue)
Newport Fab, LLC
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.