Granted Patent
Utility
US 6,777,793 · App. 10/289,852
Packaging substrate with electrostatic discharge protection
Inventors:
Meng-Tsang Lee, Kuang-Lin Lo
Patented Case
View Patent ↗
Granted: Aug 17, 2004
Filed: Nov 7, 2002
Inventors
Meng-Tsang Lee
Kuang-Lin Lo
Assignee (at issue)
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.