Granted Patent
Utility
US 6,781,172 · App. 09/800,493
Semiconductor device with adhesion-improvement capacitor and process for producing the device
Inventors:
Hiroshi Moriya, Tomio Iwasaki, Hiroyuki Ohta, Shinpei Iijima, Isamu Asano, Yuzuru Ohji, Yoshitaka Nakamura
Patented Case
View Patent ↗
Granted: Aug 24, 2004
Filed: Mar 8, 2001
Inventors
Hiroshi Moriya
Tomio Iwasaki
Hiroyuki Ohta
Shinpei Iijima
Isamu Asano
Yuzuru Ohji
Yoshitaka Nakamura
Assignee (at issue)
HITACHI, LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.