Granted Patent
Utility
US 6,781,223 · App. 10/146,904
Semiconductor device having a signal lead exposed on the undersurface of a sealing resin with an air gap between the signal lead and a mounting substrate
Inventors:
Takayuki Mihara, Yuji Akasaki
Patented Case
View Patent ↗
Granted: Aug 24, 2004
Filed: May 17, 2002
Inventors
Takayuki Mihara
Yuji Akasaki
Assignee (at issue)
Fujitsu Limited
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.