Granted Patent
Utility
US 6,781,224 · App. 10/262,074
Semiconductor device and package including forming pyramid mount protruding through silicon substrate
Inventors:
Yoshiyuki Yoneda, Masaharu Minamizawa, Eiji Watanabe, Mitsutaka Sato
Patented Case
View Patent ↗
Granted: Aug 24, 2004
Filed: Oct 2, 2002
Inventors
Yoshiyuki Yoneda
Masaharu Minamizawa
Eiji Watanabe
Mitsutaka Sato
Assignee (at issue)
Fujitsu Limited
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.