IP Library › Granted Patent US 6,781,226
Granted Patent Utility
US 6,781,226 · App. 10/452,113

Reconfigurable processor module comprising hybrid stacked integrated circuit die elements

Inventors: Jon M. Huppenthal, D. James Guzy
Patented Case View Patent ↗
Granted: Aug 24, 2004 Filed: Jun 2, 2003
Inventors
Jon M. Huppenthal
D. James Guzy
Assignee (at issue)
Arbor Company, LLLP

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Quick Facts
Patent No.
US 6,781,226
App. No.
10/452,113
Filed
2003-06-02
Granted
2004-08-24
Kind
B2