IP Library › Granted Patent US 6,783,862
Granted Patent Utility
US 6,783,862 · App. 10/290,682

Toughness, adhesion and smooth metal lines of porous low k dielectric interconnect structures

Inventors: Jeffrey Hedrick, Kang-Wook Lee, Kelly Malone, Christy S. Tyberg
Patented Case View Patent ↗
Granted: Aug 31, 2004 Filed: Nov 8, 2002
Inventors
Jeffrey Hedrick
Kang-Wook Lee
Kelly Malone
Christy S. Tyberg
Assignee (at issue)
International Business Machines Corporation

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Quick Facts
Patent No.
US 6,783,862
App. No.
10/290,682
Filed
2002-11-08
Granted
2004-08-31
Kind
B2