IP Library Granted Patent US 6,783,921
Granted Patent Utility
US 6,783,921 · App. 10/059,107

Method for etching laminated assembly including polyimide layer

Inventors: Shingo Kaimori, Tsuyoshi Nonaka, Satoshi Koshimuta, Masato Tsurugasaki
Patented Case View Patent ↗
Granted: Aug 31, 2004 Filed: Jan 31, 2002
Inventors
Shingo Kaimori
Tsuyoshi Nonaka
Satoshi Koshimuta
Masato Tsurugasaki
Assignees (at issue)
SUMITOMO ELECTRIC INDUSTRIES, LTD.
Fuchigami Micro Co., Ltd.

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Quick Facts
Patent No.
US 6,783,921
App. No.
10/059,107
Filed
2002-01-31
Granted
2004-08-31
Kind
B2