Granted Patent
Utility
US 6,784,025 · App. 10/301,924
Semiconductor package with a die attach adhesive having silane functionality
Inventor:
Osama M. Musa
Patented Case
View Patent ↗
Granted: Aug 31, 2004
Filed: Nov 20, 2002
Inventor
Osama M. Musa
Assignee (at issue)
National Starch and Chemical Investment Holding Copporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.