Granted Patent
Utility
US 6,790,293 · App. 10/147,171
Solder work material for forming solder-coated circuit board and circuit board
Inventors:
Masahiro Nomura, Toshiyuki Oga, Takanobu Gido, Takao Ono, Yoshiyuki Takahashi, Rika Sasaki
Patented Case
View Patent ↗
Granted: Sep 14, 2004
Filed: May 13, 2002
Inventors
Masahiro Nomura
Toshiyuki Oga
Takanobu Gido
Takao Ono
Yoshiyuki Takahashi
Rika Sasaki
Assignees (at issue)
NEC CORPORATION
TAMURA KAKEN CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.