Granted Patent
Utility
US 6,794,017 · App. 10/459,287
Mold-resistant corrugated carboard for void-forming structures and process
Inventors:
Dominic Hamel Comeau, Michael L. Rosenblat
Patented Case
View Patent ↗
Granted: Sep 21, 2004
Filed: Jun 11, 2003
Inventors
Dominic Hamel Comeau
Michael L. Rosenblat
Assignee (at issue)
Voidform International Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.