Granted Patent
Utility
US 6,811,473 · App. 10/607,626
Process for machining a wafer-like workpiece
Inventors:
Timon Heimes, Hermann Dumm
Patented Case
View Patent ↗
Granted: Nov 2, 2004
Filed: Jun 27, 2003
Inventors
Timon Heimes
Hermann Dumm
Assignee (at issue)
Siltronic AG Corporate Intellectual Property
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.