Granted Patent
Utility
US 6,811,662 · App. 10/604,857
Sputtering apparatus and manufacturing method of metal layer/metal compound layer by using thereof
Inventor:
Yu-Cheng Liu
Patented Case
View Patent ↗
Granted: Nov 2, 2004
Filed: Aug 22, 2003
Inventor
Yu-Cheng Liu
Assignee (at issue)
POWERCHIP SEMICONDUCTOR CORP.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.