IP Library › Granted Patent US 6,812,576
Granted Patent Utility
US 6,812,576 · App. 10/145,496

Fanned out interconnect via structure for electronic package substrates

Inventors: Siamak Fazelpour, Mark Patterson
Patented Case View Patent ↗
Granted: Nov 2, 2004 Filed: May 14, 2002
Inventors
Siamak Fazelpour
Mark Patterson
Assignee (at issue)
APPLIED MICRO CIRCUITS CORPORATION

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Quick Facts
Patent No.
US 6,812,576
App. No.
10/145,496
Filed
2002-05-14
Granted
2004-11-02
Kind
B1