Granted Patent
Utility
US 6,818,550 · App. 10/192,655
Method of cutting a wafer into individual chips
Inventor:
Kazutaka Shibata
Patented Case
View Patent ↗
Granted: Nov 16, 2004
Filed: Jul 11, 2002
Inventor
Kazutaka Shibata
Assignee (at issue)
ROHM CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.