Granted Patent
Utility
US 6,825,065 · App. 10/632,589
Method for optical module packaging of flip chip bonding
Inventors:
Jong Tae Moon, Yong Sung EOM
Patented Case
View Patent ↗
Granted: Nov 30, 2004
Filed: Aug 1, 2003
Inventors
Jong Tae Moon
Yong Sung EOM
Assignee (at issue)
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.