Granted Patent
Utility
US 6,828,512 · App. 10/267,158
Apparatus and methods for interconnecting components to via-in-pad interconnects
Inventors:
C. K. Chung, Sook Chien Chan, Kum Leong
Patented Case
View Patent ↗
Granted: Dec 7, 2004
Filed: Oct 8, 2002
Inventors
C. K. Chung
Sook Chien Chan
Kum Leong
Assignee (at issue)
Intel Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.