Granted Patent
Utility
US 6,828,664 · App. 10/282,422
Packaging substrate with electrostatic discharge protection
Inventors:
Chih-Pin Hung, Yung-Chi Lee
Patented Case
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Granted: Dec 7, 2004
Filed: Oct 29, 2002
Inventors
Chih-Pin Hung
Yung-Chi Lee
Assignee (at issue)
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.