Granted Patent
Utility
US 6,831,823 · App. 10/212,870
Method and apparatus for chucking a substrate
Inventor:
Shuya Ishida
Patented Case
View Patent ↗
Granted: Dec 14, 2004
Filed: Aug 7, 2002
Inventor
Shuya Ishida
Assignee (at issue)
NISSIN ELECTRIC CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.