IP Library › Granted Patent US 6,841,103
Granted Patent B2
US 6,841,103 · App. 09/778,805 · Granted Jan 11, 2005

Injection molding apparatus and method

Assignee: Sony Disc Technology Inc.
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Quick Facts
Patent No.
US 6,841,103
App. No.
09/778,805
Granted
Jan 11, 2005
Kind
B2
Abstract

The present invention is directed to an injection molding apparatus and method capable of preventing the occurrence of over-packing. The apparatus includes a pair of dies for forming a plurality of cavities therebetween; die closing devices for closing the pair of dies under a prescribed pressure; an injection device for injecting a molten resin into respective cavities under a prescribed pressure; and, a control device for controlling the die closing devices and the injection device. Further, the apparatus comprises a plurality of pressure sensors for detecting respective pressures in respective cavities and a control device that controls the injection device and/or the die closing devices to reduce the rate of injection of the molten resin and/or the force of closing the dies and, otherwise, stops the injection and/or the die closing operation when the pressure difference between cavities is found to be greater than a prescribed value on the basis of sensed values from the respective pressure sensors.

Claims (23)

1. An injection molding method utilizing an injection molding apparatus having at least a pair of dies that are openable and closable for forming a plurality of cavities therebetween when said pair of dies are closed, into which a molten resin is injected, said method comprising the steps of:

detecting the pressure in each of said plurality of cavities, respectively; and

when a pressure difference between said plurality of cavities exceeds a predetermined value, reducing the rate of injection of the molten resin and/or the die closing force.

2. An injection molding method utilizing an injection molding apparatus having at least a pair of dies that are openable and closable for forming a plurality of cavities therebetween when said pair of dies are closed, into which a molten resin is injected, said method comprising the steps of:

detecting the pressure in each of said plurality of cavities, respectively; and when a pressure difference between said plurality of cavities exceeds a predetermined value, stopping injection of the molten resin and/or application of a die closing force.

3. An injection molding apparatus, comprising:

at least a pair of dies that are openable and closable for forming a plurality of cavities therebetween when said pair of dies are closed;

die closing means for closing said pair of dies under a prescribed pressure;

injection means for injecting a molten resin under a prescribed pressure into said plurality of cavities formed between said pair of dies when said dies are closed;

control means for controlling said die closing means and said injection means; and

a plurality of pressure detection means for detecting pressure in each of said plurality of cavities, wherein:

said control means controls said injection means and said die closing means in accordance with a detected value from said plurality of pressure detection means,

wherein when a pressure difference among said plurality of cavities is found to be greater than a prescribed value, said control means controls the rate of injection of the molten resin and/or the die closing force to be reduced, in accordance with the detected values from said plurality of pressure detection means.

4. An injection molding apparatus, comprising:

at least a pair of dies that are openable and closable for forming a plurality of cavities therebetween when said pair of dies are closed;

die closing means for closing said pair of dies under a prescribed pressure;

injection means for injecting a molten resin under a prescribed pressure into said plurality of cavities formed between said pair of dies when said dies are closed;

control means for controlling said die closing means and said injection means; and

a plurality of pressure detection means for detecting pressure in each of said plurality of cavities, wherein:

said control means controls said injection means and said die closing means in accordance with a detected value from said plurality of pressure detection means,

wherein when a pressure difference among said plurality of cavities is found to be greater than a prescribed value, said control means stops the injection of the molten resin and/or application of a die closing force, in accordance with the detected values from said plurality of pressure detection means.

5. The injection molding apparatus according to any one of claims 3 or 4 , wherein said control means carries out its control in accordance with a program which presets injection conditions at a first molding in an injection molding operation.

6. The injection molding apparatus according to any one of claims 3 or 4 , wherein said control means controls the quantity of injection of the molten resin in a first molding instance in its injection molding operation becomes 1/n or less compared with a quantity of injection thereof in a second and subsequent molding instances, provided that there exist n cavities.

Assignments (3)
CHANGE OF NAME Recorded Jan 4, 2006
From: SONY DISC TECHNOLOGY INC.
To: SONY DISC & DIGITAL SOLUTIONS INC.
Reel/Frame 017154/0974 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 18, 2004
From: KISHI, SHINSUKE; YOSHIMURA, HIDEAKI
To: SONY DISC TECHNOLOGY, INC.
Reel/Frame 015391/0308 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 15, 2001
From: KISHI, SHINSUKE; YOSHIMURA, HIDEAKI
To: SONY CORPORATION
Reel/Frame 011815/0582 →
Priority Claims (1)
JP P2000-038115 · Feb 9, 2000 · national
Continuity (1)
Related Publication 20010019183A1 · Sep 6, 2001