Dual wafer load lock
A method and apparatus for transferring a substrate between a first environment having a first pressure and a second environment having a vacuum pressure is provided. In one embodiment, the apparatus comprises a chamber body having a first port disposed in a first wall and a second port disposed in a second wall that seals the chamber from the first and second environments. A cooling plate, a first substrate holder and a second substrate holder are disposed within the chamber body. The cooling plate is disposed at the bottom of the chamber body. The first port and the second port are sequentially opened and the pressure within the load lock regulated to allow substrate to pass through the load lock. A window is disposed in the top of the chamber body that allows a metrology device to view the chamber volume.
1. A method for transferring semiconductor substrates between a first environment having a first pressure and a second environment in a vacuum chamber having a vacuum pressure using a single load lock chamber, the method comprising:
transferring a single substrate from the first environment to a first substrate holder in the load lock chamber while the load lock chamber is open to the first environment;
determining a metric of the substrate by viewing the substrate through a window disposed in a top of the load lock chamber;
evacuating the load lock chamber; and
removing the substrate into the second environment.
2. A method for transferring semiconductor substrates between a first environment having a first pressure and a second environment having a vacuum pressure using a single load lock chamber, the method comprising:
transferring a substrate to a first substrate holder;
determining a metric of the substrate by viewing the substrate through a window disposed in a top of the chamber;
evacuating the chamber; and
removing the substrate into the second environment,
wherein the determining the metric of the substrate further comprises:
moving a cooling plate to contact the substrate;
rotating the cooling plate and substrate; and
determining an orientation or center of the substrate.
3. The method of claim 1 , wherein the substrate disposed on the first substrate holder is an unprocessed substrate.
4. The method of claim 3 further comprising:
transferring a processed substrate from the second environment to a second substrate holder disposed in the load lock chamber;
moving a cooling plate to contact the processed substrate;
venting the load lock chamber; and
removing the processed substrate into the first environment.
5. The method of claim 3 further comprising:
heating the unprocessed substrate disposed on the first substrate holder.
6. A method for transferring semiconductor substrates between a first environment in a factory interface having a first pressure and a second environment in a vacuum chamber having a vacuum pressure using a single load lock chamber, the method comprising:
transferring a processed substrate from the second environment to a first substrate holder disposed in the load lock chamber;
moving a cooling plate to contact the processed substrate disposed on the first substrate holder;
venting the load lock chamber;
removing the processed substrate into the first environment;
transferring an unprocessed substrate from the first environment to a second substrate holder above the first substrate holder;
heating the unprocessed substrate disposed on the second substrate holder;
evacuating the load lock chamber;
determining a metric of the processed and/or unprocessed substrate while the respective substrate is disposed in the load lock chamber; and then
removing the unprocessed substrate into the second environment.
7. A method for transferring semiconductor substrates between a first environment having a first pressure and a second environment having a vacuum pressure using a single load lock chamber, the method comprising:
transferring a processed substrate from the second environment to a first substrate holder disposed in the chamber;
moving a cooling plate to contact the processed substrate disposed on the first substrate holder;
venting the chamber;
removing the processed substrate into the first environment;
transferring an unprocessed substrate from the first environment to a second substrate holder above the first substrate holder;
heating the unprocessed substrate disposed on the second substrate holder;
evacuating the chamber;
removing the unprocessed substrate into the second environment; and
determining a metric of the processed and/or unprocessed substrate,
wherein the step of determining the metric of the unprocessed substrate further comprises:
moving the cooling plate to contact the unprocessed substrate;
rotating the cooling plate and unprocessed substrate; and
determining an orientation or center of the unprocessed substrate.