IP Library › Granted Patent US 6,880,563
Granted Patent B2
US 6,880,563 · App. 10/050,161 · Granted Apr 19, 2005

Apparatus and method of cleaning a substrate

Assignee: Semiconductor Leading Edge Technologies, Inc
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Quick Facts
Patent No.
US 6,880,563
App. No.
10/050,161
Granted
Apr 19, 2005
Kind
B2
Abstract

A cleaning apparatus is provided with a processing bath to be filled with a cleaning chemical, an ultrasonic oscillator, and a retainer for holding a substrate to be immersed into a cleaning chemical. The front surface of the substrate is cleaned while ultrasonic waves are radiated from the ultrasonic oscillator onto the back surface of the substrate.

Claims (23)

1. A substrate cleaning apparatus comprising:

a processing bath to be filled with a cleaning chemical;

an ultrasonic oscillator disposed in the processing bath and immersed in the cleaning chemical; and

a retainer for retaining a substrate to be immersed in the cleaning chemical such that ultrasonic waves originating from the ultrasonic oscillator are radiated onto a back surface of the substrate; and

propagation control apparatus for scattering or damping ultrasonic waves originating from the ultrasonic oscillator,

wherein the ultrasonic oscillator has a plurality of oscillation sources disposed in a uniformly dispersed manner.

2. A substrate cleaning apparatus comprising:

a processing bath to be filled with a cleaning chemical;

an ultrasonic oscillator disposed in the processing bath and immersed in the cleaning chemical;

a retainer for retaining a substrate to be immersed in the cleaning chemical such that ultrasonic waves originating from the ultrasonic oscillator are radiated onto a back surface of the substrate; and

a rotary mechanism for rotating the substrate retained by the retainer.

3. A substrate cleaning apparatus comprising:

a processing bath to be filled with a cleaning chemical;

an ultrasonic oscillator disposed in the processing bath and immersed in the cleaning chemical;

a retainer for retaining a substrate to be immersed in the cleaning chemical such that ultrasonic waves originating from the ultrasonic oscillator are radiated onto a back surface of the substrate;

propagation control apparatus for scattering or damping ultrasonic waves originating from the ultrasonic oscillator; and

a rotary mechanism for rotating the substrate retained by the retainer.

4. The substrate cleaning apparatus according to claim 3 , wherein the propagation control means includes jet nozzles for squirting a chemical in the propagation path of ultrasonic waves, thus circulating a flow of chemical.

5. A substrate cleaning apparatus comprising:

a processing bath to be filled with a cleaning chemical;

an ultrasonic oscillator disposed in the processing bath and immersed in the cleaning chemical;

a retainer for retaining a substrate to be immersed in the cleaning chemical such that ultrasonic waves originating from the ultrasonic oscillator are radiated onto a back surface of the substrate; and

a propagation control apparatus for scattering or damping ultrasonic waves originating from the ultrasonic oscillator, wherein the propagation control apparatus is constituted by means of placing, in a propagation path of ultrasonic waves, a plate-like member having a plurality of openings selectively formed therein.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 8, 2010
From: RENESAS TECHNOLOGY CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024953/0358 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 23, 2005
From: SEMICONDUCTOR LEADING EDGE TECHNOLOGIES, INC.
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 016835/0826 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 18, 2002
From: KUME, SATOSHI
To: SEMICONDUCTOR LEADING EDGE TECHNOLOGIES, INC.
Reel/Frame 012507/0846 →
Priority Claims (1)
JP 2001-016964 · Jan 25, 2001 · national
Continuity (1)
Related Publication 20020096189A1 · Jul 25, 2002