Packaged image sensing microelectronic devices including a lead and methods of packaging image sensing microelectronic devices including a lead
View Patent ↗Packaged microelectronic devices and methods of packaging microelectronic devices are disclosed herein. In one embodiment, the device includes an image sensor die having a first side with a bond-pad, an active area on the first side, and a second side opposite the first side. The device further includes a window at the first side of the image sensor die and a lead mounted to the second side of the image sensor die. The window is radiation transmissive and positioned over the active area of the image sensor die. The lead is electrically coupled to the bond-pad on the image sensor die.
1. A packaged microelectronic device, comprising:
an image sensor die having a first side with a bond-pad, an active area on the first side, and a second side opposite the first side;
a radiation transmissive window attached to the first side of the die and positioned over the active area; and
a lead mounted to the second side of the image sensor die and electrically coupled to the bond-pad.
2. The device of claim 1 , further comprising a casing over the bond-pad, at least a portion of the second side of the image sensor die, and at least a portion of the lead.
3. The device of claim 1 , further comprising a casing over the bond-pad, at least a portion of the second side of the image sensor die, and a portion of the lead; and
wherein the lead includes an end external to the casing.
4. The device of claim 1 wherein the lead is coupled to the second side of the image sensor die by a lead-on-chip tape.
5. The device of claim 1 wherein the window is attached to the image sensor die with an adhesive.
6. A packaged microelectronic device, comprising:
an image sensor die having a first side with a bond-pad, an active area on the first side, and a second side opposite the first side;
a radiation transmissive window positioned over the active area;
a lead mounted to the second side of the image sensor die and electrically coupled to the bond-pad;
a casing over the bond pad at least a portion of the second side of the image sensor die, and at a portion of the lead; and
a solder ball electrically coupled to the lead.
7. A packaged microelectronic device, comprising:
an image sensor die having a first side with a bond-pad, an active area on the first side, and a second side opposite the first side;
a radiation transmissive window positioned over the active area;
a lead mounted to the second side of the image sensor die and electrically coupled to the bond-pad; and
a casing over at least a portion of the second side of the image sensor die;
wherein the lead includes a first end and a second end opposite the first end;
wherein the first and second end are covered by the casing; and
wherein a portion of the lead between the first and second ends is exposed to an ambient environment.
8. A packaged microelectronic device, comprising:
an image sensor die having a first side with a bond-pad, an active area on the first side, and a second side opposite the first side;
a radiation transmissive window positioned over the active area;
a lead mounted to the second side of the image sensor die and electrically coupled to the bond-pad; and
a casing over at least a portion of the second side of the image sensor die;
wherein the lead includes a first portion attached to the second side of the image sensor die and a second portion at least proximate to the first portion;
wherein the casing has a recess exposing the second portion of the lead to an ambient environment; and
wherein the recess defines axis that intersects the window and the image sensor die.
9. A packaged microelectronic device, comprising:
an image sensor die having a first side with a bond-pad, an active area on the first side, and a second side opposite the first side;
a radiation transmissive window positioned over the active area;
a lead mounted to the second side of the image sensor die and electrically coupled to the bond-pad; and
a casing over at least a portion of the second side of the image sensor die and a second portion spaced apart from the first portion; and
wherein the lead includes a first portion attached to the image sensor die and a second portion spaced apart from the first portion; and
wherein the casing includes a recess exposing the second portion of the lead for attachment to a substrate.
10. A packaged microelectronic device, comprising:
an image sensor die having a first side with a bond-pad, an active area on the first side, and a second side opposite the first side;
a radiation transmissive window positioned over the active area; and
a lead mounted to the second side of the image sensor die and electrically coupled to the bond-pad;
wherein the window includes a first side and a second side attached to the image sensor die and opposite the first side; and
wherein the device further comprises a removable protective covering over at least a portion of the first side of the window.
11. A packaged microelectronic device, comprising:
an image sensor die having a first side with an active area, a plurality of bond-pads on the first side, and a second side opposite the first side;
a radiation transmissive member juxtaposed to the first side of the image sensor die;
a plurality of leads carried by the second side of the image sensor die and electrically coupled to corresponding bond-pads; and
a casing covering the bond-pads, at least a portion of the second side of the image sensor die, and at least a portion of the individual leads.
12. The device of claim 11 wherein the leads include an end external to the casing.
13. The device of claim 11 , further comprising:
a plurality of ball-pads on corresponding leads; and
a plurality of solder balls on corresponding ball-pads;
wherein the leads are not exposed to an ambient environment.
14. The device of claim 11 wherein:
the leads include a first end and a second end opposite the first end;
the first and second ends are covered by the casing; and
a portion of the leads between the first and second ends are exposed to an ambient environment.
15. The device of claim 11 wherein the leads are attached to the second side of the image sensor die by a lead-on-chip tape.
16. The device of claim 11 wherein:
the leads include a first portion attached to the second side of the image sensor die and a second portion at least proximate to the first portion;
the casing has a plurality of recesses exposing the second portion of the leads; and
the recesses define a plurality of axes that intersect the window and the image sensor die.
17. The device of claim 11 wherein:
the leads include a first portion attached to the image sensor die and a second portion spaced apart from the first portion; and
the casing includes a plurality of recesses exposing the second portion of the leads for attachment to a substrate.
18. The device of claim 11 wherein:
the window includes a first side and a second side opposite the first side, the second side being attached to the image sensor die; and
the device further comprises a removable protective covering over at least a portion of the first side of the window.
19. The device of claim 11 wherein the leads include a portion external to the casing, the portion having an arcuate configuration.
20. The device of claim 11 wherein the leads include a portion external to the casing, the portion having an “L” shaped configuration.
21. The device of claim 11 wherein the radiation transmissive member comprises a window.
22. A packaged microelectronic device, comprising:
an image sensor die having a first side with a bond-pad, an active area, and a second side opposite the first side;
a window at the first side of the image sensor die;
a lead mounted to the second side of the image sensor die and electrically coupled to the bond-pad, the lead having a first end and a second end opposite the first end; and
a casing over the bond-pad and at least a portion of the second side of the image sensor die, wherein at least a portion of the second end of the lead is exposed through the casing.
23. The device of claim 22 wherein:
the lead further includes a first portion attached to the second side of the image sensor die and a second portion at least proximate to the first portion;
the casing has a recess exposing the second portion of the lead; and
the recess defines an axis that intersects the window and the image sensor die.
24. The device of claim 22 wherein the lead is attached to the second side of the image sensor die by a lead-on-chip tape.
25. The device of claim 22 wherein:
the window includes a first side and a second side opposite the first side, the second side being attached to the image sensor die; and
the device further comprises a removable protective covering over at least a portion of the first side of the window.
26. The device of claim 22 wherein the second end of the lead has an arcuate configuration.
27. The device of claim 22 wherein the second end of the lead has an “L” shaped configuration.
28. A method for packaging a microelectronic device including an image sensor die having a first side with a bond-pad, an active area, and a second side opposite the first side, the method comprising:
attaching a radiation transmissive window to the first side of the image sensor die;
mounting a lead to the second side of the image sensor die;
electrically coupling the bond-pad to the lead; and
encapsulating at least a portion of the lead and at least a portion of the second side of the image sensor die with a casing.
29. The method of claim 28 , further comprising attaching a removable protective covering over at least a portion of the window.
30. The method of claim 28 wherein the lead includes an end, and
wherein encapsulating at least a portion of the lead comprises covering the portion of the lead with the casing without covering the end of the lead.
31. The method of claim 29 , further comprising:
forming a ball-pad on the lead; and
placing a solder ball on the ball-pad.
32. The method of claim 28 wherein the lead includes a first end and a second end opposite the first end, and wherein encapsulating at least a portion of the lead comprises covering the first and second ends of the lead with the casing without covering a portion of the lead between the first and second ends.
33. The method of claim 28 wherein:
the lead includes a first portion and a second portion at least proximate to the first portion, the first portion being attached to the second side of the image sensor die; and
encapsulating at least a portion of the lead comprises covering the portion of the lead with the casing without covering the second portion of the lead.
34. The method of claim 28 wherein coupling the lead to the image sensor die comprises attaching the lead to the image sensor die with a lead-on-chip tape.
35. A method for packaging a microelectronic device, comprising:
positioning a window at an active area of a first side of an image sensor die;
mounting a lead to a second side of the image sensor die opposite the first side;
electrically coupling a bond-pad on the first side of the image sensor die to the lead;
disposing the window, the image sensor die, and the lead in a mold cavity; and
injecting a mold compound into the mold cavity to encapsulate at least a portion of the image sensor die.
36. The method of claim 35 wherein disposing the window, the image sensor die, and the lead in the mold cavity comprises applying a force to the lead to press the window against a wall of the mold cavity.
37. The method of claim 35 , further comprising:
removing the window, the image sensor, and the lead from the mold cavity as a unit;
forming a ball-pad on the lead; and
placing a solder ball on the ball-pad.
38. The method of claim 35 , further comprising attaching a removable protective covering over the window before disposing the window in the mold cavity.