Method of forming a mold and molding a micro-device
A method of forming a device including a plurality of micron or sub-micron sized features is provided. A master having a surface contour defining a plurality of features is provided. The surface contour of the master is coated with at least one layer of material to form a shell. The master is removed from the shell to form a negative image of the surface contour in the shell. The negative image in the shell is filled with material, for example, polycarbonate, polyacrylic, or polystyrene, to form a device having features substantially the same as the master. The negative image may be filled using injection molding, compression molding, embossing or any other compatible technique.
1. A method of forming a mold for a micro-device including an array of microfeatures, comprising:
providing a master having a surface contour which includes skin penetration features;
covering the surface contour with a layer of material having a thickness of about 0.01-0.2 inches;
removing the master from the layer of material to form a negative image of the master in the layer of material wherein the negative image is fillable by a flowable process;
filling the negative image fluidically with a flowable powdered metallic materiel to form a device having substantially the same features as the master; and
sintering the powdered metallic material to form the micro-device.
2. The method of claim 1 , further comprising, coating the master with a release film, before the covering of the surface contour, to facilitate removal of the master.
3. The method of claim 1 , further comprising, etching to remove the master.
4. The method of claim 3 , wherein the etchant is hydroxide.
5. The method of claim 1 , wherein the layer of material is a metal.
6. The method of claim 1 , wherein the layer of material is nickel.
7. The method of claim 1 , wherein the master is sacrificed during its removal.
8. The method of claim 1 , Wherein the negative image has at least one structural feature of about 5 microns to about 250 microns in one dimension.
9. The method of claim 1 , wherein the negative image defines recesses having a depth from its surface of about 5 microns to about 250 microns.
10. The method of claim 9 , wherein the recesses are arranged in an array of uniformly spaced rows and columns to provide a density of about 1 to about 100 of the recess per mm2.
11. The method of claim 1 , wherein the master is formed from silicon.
12. The method of claim 1 , further comprising:
individually forming portions of the master from silicon; and
connecting the portions into a complete master.
13. The method of claim 1 , wherein the layer of material is formed via sintering.
14. A method of forming a device including a plurality of micron or sub-micron sized features, the method comprising:
providing a master having a surface contour defining skin penetration features;
coating the surface contour of the master with at least one layer of material having a thickness of about 0.01-0.2 inches;
removing the master from the layer of material to form a negative image of the surface contour in the layer of material;
forming a mold insert from the negative image; and
performing injection molding to fill the negative image fluidicaily to form a device having substantially the same features as the master.
15. The method of claim 14 , wherein the injection molding is done at a vacuum.
16. The method of claim 14 , further comprising drilling holes in the features of the device to form hollow micro-needles.
17. The method of claim 14 , wherein the layer of material is at about 0.07 inches thick.
18. The method of claim 14 , further comprising, coating the master with a release film, before the covering of the surface contour, to facilitate removal of the master.
19. The method of claim 14 , further comprising, etching to remove the master.
20. The method of claim 14 , wherein the layer of material is a metal.
21. The method of claim 14 , wherein the layer of material is nickel.
22. The method of claim 14 , further comprising removing residual air during the injection molding.
23. The method of claim 14 , further comprising forming vents in the mald insert.
24. The method of claim 14 , wherein the negative image is filled with a polymer.
25. The method of claim 14 , wherein the negative image is filled with one of polyethylene, polypropylene, acrylic, cyclic olefinic copolymers, polyamide, polystyrene, polyester and polycarbonate.
26. The method of claim 16 , wherein the drilling is performed via lasers.
27. The method of claim 14 , wherein the layer of material is formed via sintering.
28. The method of claim 14 , wherein the filling step further comprises:
filling the negative image with a flowable powdered metallic material; and
sintering the powdered metallic material to form the micro-device.
29. The method of claim 14 , wherein the master is formed from silicon.
30. The method of claim 29 , further comprising:
individually forming portions of the master from silicon; and
connecting the portions into a complete master.
31. A method of forming a device including a plurality of micron or sub-micron sized features, the method comprising:
providing a master having a surface contour defining features;
coating the surface contour of the master with at least one layer of material at about 0.07 inches thick;
removing the master from the layer of material to form a negative image of the surface contour in the layer of material; and
filling the negative image to form a device having substantially the same features as the master.
32. The method claim 31 , further comprising, forming a mold insert from the negative image; and
performing injection molding to fill the negative image.
33. The method of claim 32 , wherein the injection molding is done at a vacuum.
34. The method of claim 31 , wherein the negative image is filled with a polymer.
35. The method of claim 34 , wherein the negative image is filled with one of polyethylene, polypropylene acrylic, cyclic olefinic copolymers, polyamide, polystyrenes, polyester and polycarbonate.
36. A method of forming a medical device including a plurality of micron or sub-micron sized features which form skin penetration members, the method comprising:
providing a master having a surface contour defining skin penetration features;
coating the surface contour of the master with a single layer of material having a thickness of about 0.01-0.2 inches;
removing the master from the layer of material to form a negative image of the surface contour in the layer of material
forming a mold insert from the negative image; and
performing injection molding to fill the negative image fluidically to form the medical device having substantially the same features as the master.
37. The method of claim 36 , wherein the injection molding is done at a vacuum.
38. The method of claim 36 , wherein the negative image is filled with a polymer.
39. The method of claim 38 , wherein the negative image is filled with one of polyethylene, polypropylene, acrylic, cyclic olefinic copolymers, polyamide, polystyrenes, polyester and polycarbonate.