Chip-type solid electrolytic capacitor superior in productivity and reliability thereof

1. A chip-type solid electrolytic capacitor comprising:

a capacitor element;

an anode terminal and a cathode terminal electrically connected to said capacitor element; and

a casing resin covering said capacitor element and said anode and cathode terminals,

each of said anode and cathode terminals having a bottom mount surface to be mounted on a circuit board and an exposed surface substantially perpendicular to said bottom mount surface and exposed at a side surface of said casing resin,

each of said exposed surfaces being subjected to plating to have a plated portion.

2. The chip-type solid electrolytic capacitor according to claim 1 , wherein each of said exposed surfaces further comprises a pair of non-plated portions at opposite ends of said plated portion.

3. The chip-type solid electrolytic capacitor according to claim 2 , wherein a strip-like member is disposed adjacent to each of said plated portions on a side thereof apart from said bottom mount surface, said strip-like member separating said plated portion and said casing resin from each other.

4. A lead frame for producing a chip-type solid electrolytic capacitor, comprising an anode terminal serving portion and a cathode terminal serving portion, wherein each of said anode and cathode terminal serving portions comprises a window having a plated side and a cover closing said window.

5. The lead frame according to claim 4 , wherein said plated side of the window is formed by blanking a portion of each of said anode and cathode terminal serving portions along a predetermined straight line to form a straight side of said window and applying plating to said straight side.

6. The lead frame according to claim 4 , wherein each of said windows has a shape having at least one straight side corresponding to said plated side, and said at least one straight side is formed by blanking a portion of each of said anode and cathode terminal serving portions along at least one predetermined straight line.

7. The lead frame according to claim 4 , wherein each of said windows has a polygonal shape, and a predetermined portion of each of said anode and cathode terminal serving portions is blanked along at least a first line by a thickness of said predetermined portion to form at least one side of said polygonal shape corresponding to said plated side and is bent along at least a second line by said thickness to form at least one remaining side of said polygonal shape, to thereby simultaneously form said window and said cover.

8. The lead frame according to claim 4 , wherein a side of said cover corresponding to said plated side of each of said windows forms an acute angle relative to a surface, adjacent to said plated side, of each of said anode and cathode terminal serving portions.

9. A method of producing a chip-type solid electrolytic capacitor, comprising the steps of:

preparing a lead frame having a window and a cover closing said window, said window having a straight side that has been subjected to plating;

joining a capacitor element to said lead frame;

covering said capacitor element and said lead frame with a casing resin; and

cutting said casing resin and said lead frame along said plated straight side of the window so that said plated straight side is exposed at a side surface of said casing resin.

10. The method according to claim 9 , further comprising the step of confirming presence of a part of said cover after the cutting step.

11. A method of producing a chip-type solid electrolytic capacitor, comprising the steps of:

preparing a lead frame having an anode terminal serving portion and a cathode terminal serving portion, each of said anode and cathode terminal serving portions having a window and a cover closing said window, said window having a straight side that has been subjected to plating;

joining a capacitor element to said anode and cathode terminal serving portions;

covering said capacitor element and said anode and cathode terminal serving portions with a casing resin; and

cutting said casing resin and said anode and cathode terminal serving portions along each of said plated straight sides of the windows so that said plated straight sides are exposed at side surfaces of said casing resin.

12. The method according to claim 11 , wherein, in the step of cutting said casing resin and said anode and cathode terminal serving portions, part of each of said covers adjacent to said plated straight sides is cut off from the remainder of the cover so as to be fixed to said casing resin and exposed at the side surfaces of said casing resin.

13. The method according to claim 12 , further comprising the step of confirming presence of said part of each of said covers after the step of cutting said casing resin and said anode and cathode terminal serving portions.

14. The method according to claim 11 , wherein the step of preparing said lead frame comprises blanking a portion of each of said anode and cathode terminal serving portions along a predetermined straight line to form said straight side of said window that has not been subjected to plating.

15. The method according to claim 11 , wherein the step of preparing said lead frame comprises blanking a predetermined portion of each of said anode and cathode terminal serving portions along at least a first line by a thickness of said predetermined portion to form at least said straight side of said window that has not been subjected to plating and bending said predetermined portion along at least a second line by said thickness to thereby simultaneously form said window and said cover.

16. A chip-type solid electrolytic capacitor produced by the method according to claim 11 .