IP Library Granted Patent US 6,908,227
Granted Patent B2
US 6,908,227 · App. 10/227,125 · Granted Jun 21, 2005

Apparatus for thermal management of multiple core microprocessors

Assignee: Intel Corporation
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Quick Facts
Patent No.
US 6,908,227
App. No.
10/227,125
Granted
Jun 21, 2005
Kind
B2
Abstract

An apparatus for managing the temperature of an integrated circuit having a multiple core microprocessor is described. Specifically, thermal sensors are placed at potential hot spots throughout each microprocessor core. A thermal management unit monitors the thermal sensors. If a thermal sensor identifies a hot spot, the thermal management unit adjusts the operating frequency and voltage of that microprocessor core accordingly.

Claims (17)

1. A system comprising:

a first thermal sensor sensing a first temperature of the system and generating a first digital signal having a frequency representing the first temperature;

a second thermal sensor sensing a second temperature of the system and generating a second digital signal having a frequency representing the second temperature, wherein the second temperature is a reference temperature;

a first counter coupled to the first thermal sensor and enabled by the first digital signal, the first counter counts in a first direction in response to a transition of the first digital signal;

a second counter coupled to the second thermal sensor and enabled by the second digital signal, the second counter counts in a second direction in response to a transition of the second digital signal; and

a digital controller coupled to the first counter and the second counter, wherein the digital controller compares the count values of the first counter and the second counter, wherein if the second counter reaches a target value before the first counter, the digital controller decreases an operating voltage of the system.

2. The system of claim 1 , wherein the operating voltage decrease is at a step value.

3. The system of claim 1 , wherein the digital controller adjusts an operating frequency of the system.

4. A method comprising:

monitoring a reference thermal sensor;

monitoring a plurality of thermal sensors placed in a processor having a first and a second processor core; and

increasing an operating frequency of the first processor core to improve throughput of the first processor core if a temperature at the reference thermal sensor is greater than a temperature at a thermal sensor in the first processor core.

5. The method of claim 4 , further comprising:

decreasing an operating voltage of the first processor core if the temperature at the thermal sensor exceeds the temperature at the reference thermal sensor.

6. The method of claim 5 , wherein the operating voltage adjustment is made according to a look-up table, wherein the greater the temperature at the reference thermal sensor is exceeded, the greater the operating voltage is adjusted.

7. The method of claim 4 , wherein the plurality of thermal sensors sense the temperature of a floating point unit of the first processor core.

8. The method of claim 4 , wherein the plurality of thermal sensors sense the temperature of an integer execution unit of the first processor core.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 14, 2014
From: INTEL CORPORATION
To: SONY CORPORATION OF AMERICA
Reel/Frame 032893/0199 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 23, 2002
From: RUSU, STEFAN; TAM, SIMON M.
To: INTEL CORPORATION
Reel/Frame 013232/0505 →
Continuity (1)
Related Publication 20040037346A1 · Feb 26, 2004