Ultra-high capacitance device based on nanostructures
The present invention discloses a method including providing a substrate; forming a lower conductor over the substrate; forming a conducting nanostructure over the lower conductor; forming a thin dielectric over the conducting nanostructure; and forming an upper conductor over the thin dielectric. The present invention further discloses a device including a substrate; a lower conductor located over the substrate; a conducting nanostructure located over the lower conductor; a thin dielectric located over the conducting nanostructure; and an upper conductor located over the thin dielectric.
1. A method comprising:
providing a substrate;
forming an insulating nanostructure over said substrate, said insulating nanostructure being discontinuous;
forming a thin conductor over said insulating nanostructure, said thin conductor being conformal over said insulating nanostructure and said substrate;
forming a thin dielectric over said thin conductor; and
forming an upper conductor over said thin dielectric.
2. The method of claim 1 wherein said insulating nanostructure is formed by self-assembly.
3. The method of claim 1 wherein said thin dielectric is formed by Atomic Layer Deposition (ALD).
4. The method of claim 1 wherein said insulating nanostructure is formed by Chemical Vapor Deposition (CVD).
5. The method of claim 1 wherein said insulating nanostructure is formed selectively.