IP Library Granted Patent US 6,939,722
Granted Patent B2
US 6,939,722 · App. 10/116,634 · Granted Sep 6, 2005

Method of forming magnetic memory

Assignee: NEC Electronics Corporation
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Quick Facts
Patent No.
US 6,939,722
App. No.
10/116,634
Granted
Sep 6, 2005
Kind
B2
Abstract

A method of forming a magnetic memory, includes, forming a first magnetic film over a substrate, forming a second magnetic film on the first magnetic film, forming a conductive film on second magnetic film, and forming a resist pattern on the conductive film. Then, a first pattern is formed by etching the conductive film using the resist pattern as a mask and the resist pattern is removed. Then, a first magnetic substance layer is formed by etching the second magnetic film using the first pattern as a mask.

Claims (34)

1. A method of forming a magnetic memory, comprising:

forming a first magnetic film over a substrate;

forming an intermediate film on said first magnetic film;

forming a second magnetic film on said intermediate film;

forming a conductive film on said second magnetic film;

forming an insulating film on said conductive film;

forming a resist pattern on said insulating film;

forming a first pattern by etching said insulating film using said resist pattern as a mask;

removing said resist pattern;

forming a second pattern by etching said conductive film using said first pattern as a mask;

forming a first magnetic substance layer by etching said second magnetic film using said first and second patterns as a mask;

forming a mask pattern that covers the whole of an upper surface of said first magnetic substance layer; and

forming a second magnetic substance layer by etching said first magnetic film using said mask pattern as a mask.

2. The method as claimed in claim 1 , wherein each end of said second magnetic substance layer is formed so as to be separated from an end of said first magnetic substance layer in a direction parallel to a surface of said substrate.

3. The method as claimed in claim 2 , said method further comprising after forming said second magnetic substance layer:

forming an insulation layer covering said second magnetic substance layer;

forming a contact hole that passes through said first pattern and reaches said second pattern; and

forming a wiring layer in said contact hole to electrically connect to said second pattern.

4. A method of forming a magnetic memory, comprising:

forming a first magnetic film over a substrate;

forming an intermediate film on said first magnetic film;

forming a second magnetic film on said intermediate film;

forming a conductive film on second magnetic film;

forming a resist pattern on said conductive film;

forming a first pattern by etching said conductive film using said resist pattern as a mask;

removing said resist pattern;

forming a first magnetic substance layer by etching said second magnetic film using said first pattern as a mask;

forming a mask pattern that covers the whole of an upper surface of said first magnetic substance layer; and

forming a second magnetic substance layer by etching said first magnetic film using said mask pattern as a mask.

5. The method as claimed in claim 4 , wherein each end of said second magnetic substance layer is formed so as to be separated from an end of said first magnetic substance layer in a direction parallel to a surface of said substrate.

6. The method as claimed in claim 5 , said method further comprising after forming said second magnetic substance layer:

forming an insulation layer covering said second magnetic substance layer;

forming a contact hole that passes through said first pattern and reaches said second pattern; and

forming a wiring layer in said contact hole to electrically connected to said second pattern.

Assignments (4)
CHANGE OF ADDRESS Recorded Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
CHANGE OF NAME Recorded Dec 13, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025486/0530 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 19, 2003
From: NEC CORPORATION
To: NEC ELECTRONICS CORPORATION
Reel/Frame 013745/0188 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 4, 2002
From: OKAZAWA, TAKESHI; TSUJI, KIYOTAKA
To: NEC CORPORATION
Reel/Frame 012772/0157 →
Priority Claims (1)
JP 2001-109166 · Apr 6, 2001 · national
Continuity (1)
Related Publication 20020146851A1 · Oct 10, 2002