Optical data link
An optical data link comprises a housing, a circuit board, a semiconductor electrical device, an electrically insulating sealing resin, an optical subassembly, a first heat spreader, and a second heat spreader. The circuit board is provided in the housing. The semiconductor electrical device is provided on the circuit board. The electrically insulating sealing resin covers the semiconductor electrical device. The optical subassembly is supported by the housing. The optical subassembly includes a semiconductor optical device. The semiconductor optical device is connected to the semiconductor electrical device through the circuit board. The first heat spreader is provided between the housing and the semiconductor electrical device and is in contact with the housing. The second heat spreader is provided between the housing and the optical subassembly and is in contact with the housing and the optical subassembly. The second heat spreader is located apart from the first heat spreader.
1. An optical data link comprising:
a housing;
a circuit board provided in the housing;
a semiconductor electrical device provided on the circuit board;
an electrically insulative member covering the semiconductor device;
an optical subassembly supported by the housing, the optical subassembly including a semiconductor optical device connected to the semiconductor electrical device through the circuit board;
a first heat spreader provided between the housing and the semiconductor electrical device, the first heat spreader being in contact with the housing; and
a second heat spreader provided between the housing and the optical subassembly, the second heat spreader being in contact with the housing and the optical subassembly,
wherein the second heat spreader is located apart from the first heat spreader.
2. The optical data link according to claim 1 ,
wherein the housing includes a base and a cover, the base supports the circuit board, and the circuit board is provided between the base and the cover,
wherein the semiconductor electrical device is provided between the circuit board and the cover,
wherein the first heat spreader is provided between the circuit board and the cover so as to be in contact with the cover and the insulative member, and
wherein the second heat spreader is provided between the optical subassembly and the cover so as to be in contact with the cover.
3. The optical data link according to claim 1 ,
wherein the housing includes a base and a cover, the base supports the circuit board, and the circuit board is provided between the base and the cover,
wherein the semiconductor device is provided between the circuit board and the base,
wherein the circuit board has a thermal via provided is in a predetermined region thereof and the semiconductor device is mounted on the predetermined region, and
wherein the first heat spreader is provided between the circuit board and the cover so as to be in contact with the cover and the thermal via.
4. The optical data link according to claim 1 ,
wherein the housing includes a base and a cover, the base supports the circuit board, and the circuit board is provided between the cover and the base,
wherein the semiconductor electrical device is provided between the circuit board and the cover,
wherein the first heat spreader is provided between the circuit board and the cover so as to be in contact with the cover and the insulative member, and
wherein the second heat spreader is provided between the optical subassembly and the base so as to be in contact with the base.
5. The optical data link according to claim 1 ,
wherein the housing includes a base and a cover, the base supports the circuit board, and the circuit board is provided between the base and the cover,
wherein the semiconductor electrical device is provided between the circuit board and the base,
wherein the first heat spreader is provided between the circuit board and the base so as to be in contact with the base and the insulative member, and
wherein the second heat spreader is provided between the optical subassembly and the cover so as to contact with the cover.
6. The optical data link according to claim 1 ,
wherein the housing includes a base and a cover, the base supports the circuit board, and the circuit board is provided between the base and the cover,
wherein the semiconductor electrical device is provided between the circuit board and the base,
wherein the first heat spreader is provided between the circuit board and the base so as to be in contact with the base and the insulative member, and
wherein the second heat spreader is provided between the optical subassembly and the base so as to be in contact with the base.
7. The optical data link according to claim 1 ,
wherein the first heat spreader is in contact with a first region of the cover,
wherein the second heat spreader is in contact with a second region of the cover, and
wherein the cover has an opening provided between the first and second regions.
8. The optical data link according to claim 2 ,
wherein the base and the cover form a cavity and the circuit board is provided in the cavity, and
wherein the cover has first and second fingers, the first finger is bent into the cavity so as to be in contact with the first heat spreader, and the second finger is bent into the cavity so as to be in contact with the second heat spreader.
9. The optical data link according to claim 8 ,
wherein the cover has a side wall and a lid, and
wherein the first and second fingers are provided in at least one of the side wall and the lid.
10. The optical data link according to claim 8 ,
wherein the cover has an opening provided between the first and second fingers.
11. The optical data link according to claim 2 ,
wherein the base supports a plurality of lead terminals, and
wherein the circuit board makes an angle from 10 degrees to 80 degrees with respect to the base.
12. The optical data link according to claim 8 , further comprising:
another optical subassembly provided in the housing;
another circuit board provided in the housing; and
an electronic component mounted on the other circuit board, the electronic component being electrically connected to the other optical subassembly, and
wherein the cover has a third finger bent into the cavity for transferring heat from the second circuit board, and
wherein the cover has an opening provided between the first and third fingers.
13. The optical data link according to claim 1 ,
wherein the circuit board includes a conductive pattern provided on a primary surface thereof,
wherein the conductive pattern is connected to the semiconductor device, and
wherein the first heat spreader is in contact with the conductive pattern.
14. The optical data link according to claim 1 , further comprising:
a connection board connected with the optical subassembly; and
a flexible printed board connecting the circuit board with the connection board,
wherein the optical subassembly has a lead terminal connected to the connection board.
15. The optical data link according to claim 1 ,
wherein the first and second heat spreaders are electrically insulative.
16. The optical data link according to claim 1 ,
wherein at least one of the first and second heat spreaders have elasticity sufficient to deform in accordance with the shapes of the cover, the semiconductor electrical device and optical subassembly.
17. The optical data link according to claim 1 ,
wherein at least one of the first and second heat spreaders includes a silicone gel.
18. The optical data link according to claim 1 ,
wherein the semiconductor optical device contains a semiconductor light-emitting device driven by the semiconductor electrical device.
19. The optical data link according to claim 1 ,
wherein the first and second heat spreaders are made of material having a thermal conductivity of 0.5 to 50 W/m/K.
20. The optical data link according to claim 1 ,
wherein the first and second heat transfer are made of material having hardness of 10 to 100 under the ASKER-C defined in the Society of Rubber Institute Standard (SRIS) 0101.