Method for connecting microchips to an antenna arranged on a support strip for producing a transponder

1. A method of connecting micro-chips to antennas arranged on a first carrier tape for the manufacture of a transponder, wherein the micro-chips are packaged in a preceding bonding process to form a chip module with electrical terminals and are applied to a second carrier tape, and wherein the two carrier tapes are unwound from a reel and brought one above the other, whereby the chip modules are removed from the second carrier tape and placed at a predetermined point on the first carrier tape.

2. A method according to claim 1 , wherein the first carrier tape runs at a continuous speed while the second carrier tape is fed to the first carrier tape in synchronism with the passing antenna spaces via an indexer.

3. A method according to claim 1 , wherein the chip module is electrically connected to the appropriate antenna by soldering or crimping immediately after placement on the first carrier tape.

4. A method according to claim 1 , wherein the transponder is tested immediately after the connection of the chip module to the antenna.

5. A method according to claim 1 , wherein the chip module is held by a transport tape, circulating endlessly at the same speed as the first carrier tape, on the first carrier tape during the placement onto the first carrier tape until the chip module is firmly connected to the appropriate antenna.

6. A method according to claim 1 , wherein the electrical connection of the chip module to the antenna occurs by laser soldering.

7. A method of connecting micro-chips to antennas as part of the manufacture of transponders, the micro-chips having been packaged in a preceding bonding process to form chip modules with electrical terminals, the method comprising the steps of:

providing first and second carrier tapes, each of which is wound onto a reel, the first carrier tape bearing the antennas, and the second carrier tape bearing the chip modules,

unwinding the first and second carrier tapes, bringing one carrier tape above the other,

removing the chip modules from the second carrier tape, placing the chip modules at a predetermined point on the first carrier tape, and electrically connecting each chip module to a corresponding antenna.

8. A method according to claim 7 , wherein, during the unwinding process, the first carrier tape runs at a continuous speed while the second carrier tape is fed to the first carrier tape in synchronism with the passing antenna spaces via operation of an indexer.

9. A method according to claim 7 , wherein the electrically connecting step comprises, for each chip module, soldering or crimping the terminals of the chip module to the corresponding antenna immediately after placing the chip module on the first carrier tape.

10. A method according to claim 7 , further comprising testing each transponder immediately after connecting the corresponding chip module to the corresponding antenna.

11. A method according to claim 7 , wherein the removing step includes holding the chip module on the first carrier tape by a transport tape until the chip module is firmly connected to the corresponding antenna, the transport tape circulating endlessly at the same speed as the first carrier tape.

12. A method according to claim 7 , wherein the electrically connecting step comprises, for each chip module, laser soldering the terminals of the chip module to the corresponding antenna.