Method of uniformly coating a substrate
A method of and an apparatus for coating a substrate with a polymer solution to produce a film of uniform thickness, includes mounting the substrate inside an enclosed housing and passing a control gas, which may be a solvent vapor-bearing gas into the housing through an inlet. The polymer solution is deposited onto the surface of the substrate in the housing and the substrate is then spun. The control gas and any solvent vapor and particulate contaminants suspended in the control gas are exhausted from the housing through an outlet and the solvent vapor concentration is controlled by controlling the temperature of the housing and the solvent from which the solvent vapor-bearing gas is produced. Instead the concentration can be controlled by mixing gases having different solvent concentrations. The humidity of the gas may also be controlled.
1. A method for coating a surface of a substrate, comprising:
mounting the substrate within an enclosed housing;
depositing a solvent-bearing solution onto the substrate; and
controlling the evaporation of solvent from the solution by adjusting an amount of solvent introduced into the housing environment, wherein adjusting the amount of solvent introduced into the housing environment comprises adjusting a degree of saturation of a control gas introduced into the housing environment within the range between 0% and approximately 40% by mixing a plurality of gases having differing solvent vapor partial pressures to form the control gas.
2. The method of claim 1 , further comprising rotating the substrate.
3. The method of claim 2 , wherein the substrate is rotated at variable speeds.
4. The method of claim 2 , wherein the substrate is rotated at a rotational speed of less than approximately 2000 rpm.
5. The method of claim 2 , wherein the substrate rotates for a time sufficient to provide a one sigma film uniformity of no more than 4.0 Angstrom over the substrate.