Method, system and apparatus for constructing resistive vias
A system, method and apparatus for constructing capped resistive vias are disclosed. In a preferred embodiment, a bare, electronic component substrate or printed circuit board via is preferably surrounded at each opening by a conductive pad. Defined by openings at a first and second surface of the substrate and a conductive material free wall defining the via is a void filled with one or more resistive inks and/or fills. A conductive cap is preferably coupled to the conductive pads such that an opening therein and the resistive fill exposed at the surface of the substrate is substantially covered. The presence of the conductive cap enables one or more electronic component conductors to be coupled directly to the capped resistive via.
1. An information handling system, comprising:
memory;
a processor operably associated with the memory;
at least one printed circuit board operable to maintain the memory and the processor; and
a plurality of through-hole vias disposed in the printed circuit board, a selected subset of the plurality of through-hole vias configured as resistive vias having at least one type of resistive fill disposed therein such that an impedance measure, Z VIA , for the resistive vias substantially approximates
Z
VIA
=
Z
FILL
×
L
VIA
π
r
VIA
2
where Z FILL is an impedance measure for the resistive fill disposed in the via, L VIA is a measure of via length and r VIA is a measure of via radius.
2. The information handling system of claim 1 , further comprising the selected subset of resistive vias including bare plated through-hole vias.
3. The information handling system of claim 1 , further comprising a conductive cap disposed over resistive fill exposed proximate at least one open end of a resistive via.
4. The information handling system of claim 3 , further comprising a conductive pad disposed about the open end of the resistive via and wherein the conductive cap is operably coupled to the conductive pad.
5. The information handling system of claim 3 , further comprising one or more electronic components operably coupled to the printed circuit board using surface mount technology at the conductive cap of a resistive via.
6. The information handling system of claim 1 , further comprising a connecting trace operably coupled to a resistive via.
7. The information handling system of claim 6 , further comprising a copper land operably coupled to a resistive via using the connecting trace.
8. The information handling system of claim 7 , further comprising one or more electronic components operably coupled to the printed circuit board using surface mount technology at the copper land associated with a resistive via.
9. A method for creating a component substrate, comprising:
identifying desired placement and connectivity of one or more electronic components on a multi-layered substrate;
identifying a placement location for one or more resistive vias to be associated with the one or more electronic components;
identifying a desired impedance value for one or more resistive vias;
determining a length distance between a first surface and a second surface of the multi-layered substrate at each resistive via placement location;
determining an available spacing between one or more structures included on the multi-layer substrate and each resistive via location for each resistive via placement location;
balancing an impedance value associated with one or more available resistive fills with the available spacing between one or more structures and a selected resistive via placement location to achieve the desired impedance value, Z VIA , for each resistive via in accordance with
Z
VIA
=
Z
FILL
×
L
VIA
π
r
VIA
2
where Z FILL is the impedance value associated with an available resistive fill, L VIA is the length distance between the first and second surfaces of the substrate and r VIA is a measure of through-hole via inner radius, such that each through-hole via does not interfere with the one or more structures included on the substrate and such that a resistive fill selection and r VIA measure are obtained;
drilling a plurality of through-hole vias in the multi-layered substrate in accordance with the desired placement and connectivity of the one or more electronic components and the obtained r VIA measure; and
screening the selected resistive fill into the one or more through-hole vias at the identified resistive via placement locations.
10. The method of claim 9 , further comprising:
screening the resistive fill into the through-hole vias such that the screened resistive fill is exposed proximate the first and second surfaces of the substrate; and
covering the exposed resistive fill with a conductive cap such that an electronic component may be communicatively coupled thereto.
11. The method of claim 10 , further comprising coupling at least one contact of an electronic component to the conductive cap using surface mount technology.
12. The method of claim 9 , further comprising coupling a copper pad proximate one or more through-hole via openings.
13. The method of claim 12 , further comprising:
applying one or more connecting traces to the substrate and coupled to the copper pads; and
coupling one or more copper lands to the connecting traces.
14. The method of claim 13 , further comprising coupling at least one contact of an electronic component to the copper land using surface mount technology.