Method for manufacturing semiconductor device

1. A method for manufacturing a semiconductor device, the method comprising the steps of:

i) providing a first substrate and a second substrate;

ii) forming a capacitor on a first surface of the first substrate;

iii) forming an insulating layer on a resultant structure of the first substrate;

iv) bonding the second substrate to the insulating layer of the first substrate;

v) turning over a resultant structure in such a manner that a second surface of the first substrate is an upper surface of the resultant structure;

vi) polishing the second surface of the first substrate by a predetermined thickness;

vii) forming an isolation layer defining an active region by performing an isolation process with respect to the second surface of the first substrate for which a polishing process is carried out; and

viii) forming a bit line on the active region in the first substrate.

2. The method as claimed in claim 1 , wherein the second substrate is any one selected from a group consisting of a silicon wafer, a glass substrate, and a plastic substrate.

3. The method as claimed in claim 1 , wherein the active region is patterned in such a manner that the active region of each column is uniformly aligned in match with each row.

4. The method as claimed in claim 1 , wherein, in step ii), a gate line is formed with the capacitor.

5. The method as claimed in claim 1 , wherein, in step viii), a gate line is formed with the bit line.

6. A method for manufacturing a semiconductor device, the method comprising the steps of:

i) providing a first substrate and a second substrate;

ii) forming a capacitor and a gate line on a first surface of the first substrate;

iii) forming an insulating layer on a resultant structure of the first substrate;

iv) bonding the second substrate to the insulating layer of the first substrate;

v) turning a resultant structure over in such a manner that a second surface of the first substrate is an upper surface of the resultant structure;

vi) polishing the second surface of the first substrate by a predetermined thickness;

vii) forming an isolation layer for defining an active region by performing an isolation process with respect to the second surface of the first substrate for which an polishing process is finished; and

viii) forming a bit line on the active region in the first substrate.

7. The method as claimed in claim 6 , wherein the second substrate is any one selected from a group consisting of a silicon wafer, a glass substrate, and a plastic substrate.

8. The method as claimed in claim 6 , wherein the active region is patterned in such a manner that the active region of each column is uniformly aligned in match with each row.

9. A method for manufacturing a semiconductor device, the method comprising the steps of:

i) providing a first substrate and a second substrate;

ii) forming a capacitor on a first surface of the first substrate;

iii) forming a first insulating layer on the first substrate including the capacitor

iv) bonding the second substrate to the first insulating layer of the first substrate;

v) turning a resultant structure over in such a manner that a second surface of the first substrate is an upper surface of the resultant structure;

vi) polishing the second surface of the first substrate by a predetermined thickness;

vii) forming an isolation layer for defining an active region by performing an isolation process with respect to the first substrate in which a polishing process is finished; and

viii) forming sequentially a bit line and a gate line on the active region in the first substrate.

10. The method as claimed in claim 9 , wherein the second substrate is any one selected from a group consisting of a silicon wafer, a glass substrate, and a plastic substrate.

11. The method as claimed in claim 9 , wherein the active region is patterned in such a manner that the active region of each column is uniformly aligned in match with each row.