IP Library Granted Patent US 7,032,299
Granted Patent B2
US 7,032,299 · App. 10/174,951 · Granted Apr 25, 2006

Apparatus for mounting electronic parts

Assignee: Matsushita Electric Industrial Co., Ltd.
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Quick Facts
Patent No.
US 7,032,299
App. No.
10/174,951
Granted
Apr 25, 2006
Kind
B2
Abstract

An apparatus for mounting electronic parts and a method of mounting electronic parts capable of effectively performing image capturing at the time of position recognition of the electronic parts. In the apparatus, when images of electronic parts are taken for position recognition of the parts in the mounting of a plurality of the electronic parts held by a mounting head on a circuit board, it is adapted such that pixel signals are output only from specific necessary pixels. More specifically, pixel selecting information for allowing image signals to be selectively output from a plurality of specific pixels of a photodetecting section ( 10 ) of a CMOS area sensor is generated based on mounting schedule data ( 16 C) related to a mounting sequence of the electronic parts and part data of the electronic parts stored in data storage ( 16 ). A pixel selector ( 11 ) is operated in accordance with the pixel selecting information, and thus the image signals are output from the selected specific pixels.

Claims (24)

1. An apparatus for mounting electronic parts comprising:

(a) a mounting head for holding and transferring electronic parts;

(b) an image reader for taking images of the electronic parts when held by said mounting head;

(c) an image recognition section for recognizing the images taken by said image reader so as to detect positions of the electronic parts when held by said mounting head;

(d) a data storage for storing mounting schedule data specifying a mounting sequence to be performed by said mounting head for the electronic parts when held by said mounting head, and for storing part data of kinds of the electronic parts, with the part data including image capture window information indicative of image capture windows to be set within an image-taking field of view of said image reader; and

(e) a controller for causing said mounting head to perform a mounting operation based on positions of the electronic parts, as detected by said image recognition section, and the mounting schedule data, wherein

said image reader includes:

(b1) a photodetecting section having pixels;

(b2) a pixel selecting information generating section for generating, based on the mounting schedule data and the image capture window information, pixel selecting information specifying some of the pixels, as specified pixels, that are to become image capture regions in said photodetecting section; and

(b3) a pixel selecting section for allowing image signals to be selectively output from the specified pixels.

2. The apparatus for mounting electronic parts according to claim 1 , wherein:

said mounting head includes suction nozzles for sucking and holding the electronic parts,

the mounting schedule data includes information specifying correspondences between said suction nozzles and the electronic parts to be sucked and held by said suction nozzles, and

said pixel selecting information generating section is also for generating the pixel selecting information based on the information specifying the correspondences between said suction nozzles and the electronic parts to be sucked and held by said suction nozzles.

3. The apparatus for mounting electronic parts according to claim 1 , wherein:

the part data includes size information related to sizes of the electronic parts, and

said pixel selecting information generating section is also for generating the pixel selecting information based on the size information related to the sizes of the electronic parts.

4. The apparatus for mounting electronic parts according to claim 1 , wherein:

the mounting schedule data includes mounting sequence information for the electronic parts and capturing sequence setting information for setting a capturing sequence based on the mounting sequence, for providing the pixel selecting information for the image capture regions, and

said pixel selecting section is for selectively outputting image signals from the specified pixels following the capturing sequence.

5. The apparatus for mounting electronic parts according to claim 1 , wherein:

said mounting head has nozzles for sucking the electronic parts, and said mounting head is adapted to repeat mounting steps several times by reciprocally moving between a part supplying section and a circuit board so as to mount the electronic parts and other electronic parts onto a circuit board,

the mounting schedule data includes information specifying correspondences between said nozzles and those of the electronic parts and the other electronic parts that are to be transferred at each mounting step, and

said pixel selecting information generating section is also for generating the pixel selecting information based on the information specifying the correspondences between said nozzles and those of the electronic parts and the other electronic parts that are to be transferred at each mounting step.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 1, 2002
From: ARASE, MASAYUKI; HATASE, TAKAYUKI
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 013334/0193 →
Priority Claims (1)
JP 2001-187725 · Jun 21, 2001 · national
Continuity (1)
Related Publication 20030017758A1 · Jan 23, 2003