Water-cooling heat dissipation system
View Patent ↗A water-cooling heat dissipation system includes a heat sink mounted on a heat generating electronic device and a circulating loop connected to two ends of the heat sink. The circulating loop has a water pump attached at the inlet of the heat sink, a first cooling base attached at the outlet of the heat sink, and a second cooling base between the water pump and the heat sink. The second cooling base has a cryogenic chip to provide icy water to the heat sink, such that heat dissipation efficiency is greatly enhanced.
1. A water-cooling heat dissipation system used to dissipate heat generated by an electronic device, comprising:
a heat sink, mounted on the electronic device, the heat sink having a circulating loop connected to two ends of the heat sink;
a first cooling base installed in the circulating loop at an outlet of the heat sink;
a second cooling base installed in the circulating loop at an inlet of the heat sink, the second cooling base having a cryogenic chip to cool down water flowing therethrough into icy state; and
a water pump installed in the ciruclating loop between the first and the second cooling base.
2. The system as claimed in claim 1 , wherein the electronic device includes a central processing unit.
3. The system as claimed in claim 1 , wherein the first cooling base includes a heat sink mounted thereon and a cooling fan mounted on the heat sink.
4. The system as claimed in claim 1 , wherein the heat sink includes an aluminum extrusion type of fins.
5. The system as claimed in claim 1 , wherein the cryogenic chip includes a cold surface attached to the second cooling base and a hot surface.
6. The system as claimed in claim 5 , wherein the second cooling base further includes a heat sink mounted on the hot surface of the cryogenic chip and a cooling fan attached on the heat sink.
7. The system as claimed in claim 6 , wherein the heat sink includes an aluminum extrusion type of fins.