Electrical circuit apparatus and methods for assembling same
An electrical circuit apparatus ( 300 ) that includes: a substrate ( 330 ) having a ground layer ( 336 ), at least one thermal aperture ( 332 ), and at least one solder aperture ( 334 ); a heat sink ( 310 ); and an adhesive layer ( 320 ) for mechanically coupling the heat sink to the ground layer of the substrate such that at least a portion of the at least one substrate thermal aperture overlaps the heat sink, the adhesive layer having at least one thermal aperture ( 322 ) and at least one solder aperture ( 324 ), wherein aligning the at least one substrate solder aperture with the at least one adhesive layer solder aperture and aligning the at least one substrate thermal aperture with the at least one adhesive layer thermal aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.
1. A method for assembling an electrical circuit apparatus comprising a substrate having a top side, a ground layer, at least one thermal aperture, and at least one solder aperture, a heat sink, and an adhesive layer having at least one thermal aperture and at least one solder aperture, said method comprising the steps of:
a) aligning the at least one substrate solder aperture with the at least one adhesive layer solder aperture and aligning the at least one substrate thermal aperture with the at least one adhesive layer thermal aperture;
b) mechanically coupling said heat sink to the ground layer of said substrate using said adhesive layer such that at least a portion of said at least one substrate thermal aperture overlaps said heat sink;
c) filling at least a portion of said at least one adhesive layer solder aperture and at least a portion of said at least one substrate thermal aperture with solder; and
d) performing a process for solder wetting, wherein the aligning of the at least one substrate solder aperture with the at least one adhesive layer solder aperture and the aligning of the at least one substrate thermal aperture with the at least one adhesive layer thermal aperture causes said solder to flow from the at least one adhesive layer solder aperture to a predetermined area between said heat sink and the ground layer of said substrate.
2. The method of claim 1 , wherein said electrical circuit apparatus further comprises a device, and wherein said method further comprises the step after step c) of mounting said device onto the topside of said substrate such that at least a portion of said device covers at least a portion of said at least one substrate thermal aperture and such that said device is coupled to said heat sink via at least a portion of said at least one substrate thermal aperture.
3. The method of claim 2 , wherein said device is coupled to said substrate and said heat sink and said solder wetting occurs during a single pass solder reflow process.
4. The method of claim 3 , wherein said solder reflow process uses a no-lead solder.
5. The method of claim 3 , wherein said solder reflow process uses a leaded solder.
6. The method of claim 1 , wherein at least a portion of the steps of said method are performed as part of an automated process.
7. The method of claim 1 , wherein at least a portion of the steps of said method are performed manually.
8. A method for assembling an electrical circuit apparatus comprising a substrate having a top side, a ground layer, and at least one solder aperture, a heat sink, and an adhesive layer having at least one solder aperture, said method comprising the steps of:
a) aligning the at least one substrate solder aperture with the at least one adhesive layer solder aperture;
b) mechanically coupling said heat sink to the ground layer of said substrate using said adhesive layer;
c) filling at least a portion of said at least one adhesive layer solder aperture with solder; and
d) performing a process for solder wetting, wherein the aligning of the at least one substrate solder aperture with the at least one adhesive layer solder aperture causes said solder to flow from said at least one adhesive layer solder aperture to a predetermined area between said heat sink and the ground layer of said substrate.
9. The method of claim 8 , wherein said electrical circuit apparatus further comprises a device, and wherein said method further comprises the step after step c) of mounting said device onto the topside of said substrate.
10. The method of claim 9 , wherein said device is coupled to said substrate and said solder wetting occurs during a single pass solder reflow process.
11. The method of claim 10 , wherein said solder reflow process uses a no-lead solder.
12. The method of claim 10 , wherein said solder reflow process uses a leaded solder.
13. The method of claim 8 , wherein at least a portion of the steps of said method are performed as part of an automated process.
14. The method of claim 8 , wherein at least a portion of the steps of said method are performed manually.
15. The method of claim 8 , wherein said substrate further comprises at least one venting hole, and step a) further comprises aligning said at least one venting hole with said at least one adhesive layer solder aperture.