IP Library Granted Patent US 7,078,783
Granted Patent B2
US 7,078,783 · App. 10/767,568 · Granted Jul 18, 2006

Vertical unipolar component

Assignee: STMicroelectronics S.A.
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Quick Facts
Patent No.
US 7,078,783
App. No.
10/767,568
Granted
Jul 18, 2006
Kind
B2
Abstract

A vertical unipolar component formed in a semiconductor substrate. An upper portion of the substrate includes insulated trenches filled with a vertical multiple-layer of at least two conductive elements separated by an insulating layer, the multiple-layer depth being at most equal to the thickness of the upper portion.

Claims (11)

1. A vertical unipolar component formed in a semiconductor substrate, said component comprising junctions formed at the surface of parts of said substrate separated with insulated trenches extending in an upper portion of the substrate, in which the insulated trenches are filled with a vertical multiple-layer of at least two conductive elements separated by an insulating layer, the multiple-layer depth being, at most, equal to the thickness of said upper portion.

2. The component of claim 1 , wherein the multiple-layer depth is equal to the thickness of the upper portion, the insulating layer also separating the elements of a substrate portion underlying the upper portion.

3. The component of claim 1 , wherein at least part of the elements are conductive grains.

4. The component of claim 1 , wherein at least part of the elements are blocks exhibiting, in top view, a same surface area as the multiple-layer.

5. The component of claim 1 , forming a Schottky diode having its cathode corresponding to said upper portion.

6. A vertical unipolar component formed in a semiconductor substrate, the component comprising junctions formed at a surface of regions of the substrate separated by insulated trenches extending in an upper portion of the substrate, wherein the insulated trenches contain at least two conductive elements separated by an insulating layer.

7. The component of claim 6 , wherein a depth of the at least two conductive elements separated by an insulating layer is, at most, equal to a thickness of the upper portion.

8. The component of claim 6 , wherein the insulating layer also separates elements of a substrate portion underlying the upper portion.

9. The component of claim 6 , wherein at least part of the elements are conductive grains.

10. The component of claim 6 , wherein at least part of the elements are blocks exhibiting, in top view, a same surface area as one of the trenches.

11. The component of claim 6 , forming a Schottky diode having its cathode corresponding to said upper portion.

Assignments (2)
CHANGE OF NAME Recorded Jan 21, 2024
From: STMICROELECTRONICS SA
To: STMICROELECTRONICS FRANCE
Reel/Frame 066357/0435 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 29, 2004
From: LANOIS, FREDERIC
To: STMICROELECTRONICS, S.A.
Reel/Frame 014947/0939 →
Priority Claims (1)
FR 03 01077 · Jan 30, 2003 · national
Continuity (1)
Related Publication 20040183115A1 · Sep 23, 2004