Plasma cutting apparatus and control unit thereof
Cutting quality of the product, in particular, hole cutting quality, in plasma arc cutting is improved. A control unit, which controls a plasma cutting apparatus for cutting a product from a plate material by moving a plasma torch at a cutting speed along a cutting path corresponding to the product shape to cut the plate material, while supplying an arc current and a plasma gas to the plasma torch and forming a plasma arc from a nozzle of the plasma torch to the plate material, conducts control so that, when a hole is cut, a cutting speed is lower, a value of the arc current value is smaller, and a plasma gas flow rate or pressure is less than those when a contour is cut.
1. A plasma cutting apparatus for cutting a product from a plate material by moving a plasma torch at a cutting speed along a cutting path corresponding to the product shape to cut said plate material, while supplying an arc current and a plasma gas to said plasma torch and forming a plasma arc from a nozzle of said plasma torch to the plate material,
said plasma cutting apparatus comprising a control unit for controlling a cutting state including said cutting speed, a value of said arc current, and a flow rate or pressure of said plasma gas,
wherein said control unit conducts control so that, when the shape of said product comprises a hole and a contour and when said hole is cut, said cutting speed is lower, a value of said arc current is smaller, and a flow rate or pressure of said plasma gas is less than those when said contour is cut, wherein when said hole is cut, said control unit controls said cutting state according to a ratio of the plate thickness of said plate material and the diameter of said hole.
2. The plasma cutting apparatus according to claim 1 , wherein
an assist gas is further supplied to said plasma torch, and
said control unit conducts control so that when said hole is cut, the flow rate or pressure of said assist gas is less than that when said contour is cut.
3. The plasma cutting apparatus according to claim 1 , wherein when said hole is cut, said control unit conducts control so that said cutting speed is high, a value of said arc current is large, and a flow rate or pressure of said plasma gas is large if the ratio of the diameter of said hole to said plate thickness is large.
4. The plasma cutting apparatus according to claim 1 , wherein when said contour is cut, said control unit controls said cutting state based on the material type and plate thickness of said plate material and a nozzle diameter of said plasma torch, and when said hole is cut, said control unit controls said cutting state based on the material type of said plate material, said plate thickness, said nozzle diameter, and a ratio of the diameter of said hole to said plate thickness.
5. The plasma cutting apparatus according to claim 4 , wherein when said hole is cut, said control unit conducts control so that said cutting speed is high, a value of said arc current is large, and a flow rate or pressure of said plasma gas is large if the ratio of the diameter of said hole to said plate thickness is large.
6. The plasma cutting apparatus according to claim 4 , wherein
said control unit comprises
control settings for contours and control settings for holes of a plurality of levels that differ in the ratio of the diameter of said hole to said plate thickness, for each combination of a material type of said plate material, a plate thickness of said plate material, and the diameter of said nozzle of said plasma torch, and
when a product is cut from a plate material having given material type and plate thickness by using a plasma torch having a given nozzle diameter, if a contour is cut, said control unit controls said cutting state by using the control settings for contours that correspond to said given material type and plate thickness and said given nozzle diameter, and if a hole with a given diameter is cut, said control unit controls said cutting state by using control settings for holes with a level corresponding to a ratio of said given diameter to said given plate thickness, among control settings for holes with said plurality of levels corresponding to said given material type and plate thickness and said given nozzle diameter.
7. The plasma cutting apparatus according to claim 1 , wherein said control unit maintains said cutting state at a substantially fixed level even when the curvature of said movement path of said plasma torch changes following the advance of cutting during cutting of said contour.
8. The plasma cutting apparatus according to claim 1 , wherein said control unit maintains said cutting state at a substantially fixed level even when the curvature of said movement path of said plasma torch changes following the advance of cutting during cutting of one said hole.
9. The plasma cutting apparatus according to claim 1 , wherein said control unit controls said cutting state based on a relationship between the thickness of the plate and the diameter of said hole.
10. A plasma cutting apparatus for cutting a product from a plate material by moving a plasma torch at a cutting speed along a cutting path corresponding to the product shape to cut said plate material, while supplying an arc current and a plasma gas to said plasma torch and forming a plasma arc from a nozzle of said plasma torch to the plate material,
said plasma cutting apparatus comprising a control unit for controlling a cutting state based on a ratio of the thickness of the plate and the diameter of said hole,
said cutting state includes said cutting speed, a value of said arc current, and a flow rate or pressure of said plasma gas.
11. The control unit for controlling the plasma cutting apparatus described in claim 9 or claim 10 .
12. A plasma cutting method for cutting a product from a plate material by moving a plasma torch at a cutting speed along a cutting path corresponding to the product shape to cut said plate material, while supplying an arc current and a plasma gas to said plasma torch and forming a plasma arc from a nozzle of said plasma torch to the plate material, wherein
when the shape of said product comprises a hole and a contour, said method comprises the steps of
cutting said hole by controlling a cutting state including said cutting speed, a value of said arc current, and a flow rate or pressure of said plasma gas, and by controlling said cutting state according to a ratio of the plate thickness of the plate material and the diameter of said hole, and
cutting said contour by controlling said cutting conditions, and
in the step of cutting said hole, said cutting speed is lower, a value of said arc current is smaller, and a flow rate or pressure of said plasma gas is less than those when said contour is cut.
13. The plasma cutting method according to claim 12 , wherein the step of cutting said hole includes the controlling of said cutting state based on a relationship between the thickness of the plate and the diameter of said hole.
14. A plasma cutting method for cutting a product from a plate material by moving a plasma torch at a cutting speed along a cutting path corresponding to the product shape to cut said plate material, while supplying an arc current and a plasma gas to said plasma torch and forming a plasma arc from a nozzle of said plasma torch to the plate material,
wherein said method comprises the steps of:
cutting said hole by controlling a cutting state including said cutting speed, a value of said arc current, and a flow rate or pressure of said plasma gas, wherein the step of cutting said hole includes the controlling of said cutting state based on a ratio of the thickness of the plate and the diameter of said hole, and
cutting said contour by controlling said cutting conditions.