Sensor semiconductor package, provided with an insert, and method for making same
A semiconductor package includes a mounting and electrical connection plate, and a semiconductor component having front and rear surfaces and including a sensor. The rear surface of the semiconductor component is attached to the mounting and electrical connection plate and the front surface is attached to the sensor. An insert is adjacent the front face of the semiconductor component and the sensor and has an access passage for exposing the sensor. A plug is in the access passage of the insert. A body of encapsulation material surrounds the mounting and electrical connection plate, the semiconductor component and the insert.
1. A semiconductor package comprising:
a lead frame;
a semiconductor component having front and rear surfaces and comprising a sensor, the rear surface being attached to said lead frame and the front surface being attached to said sensor;
an insert adjacent the front face of said semiconductor component and said sensor, said insert having an access passage for exposing said sensor;
a plug positioned within a portion of the access passage of said insert; and
a body of encapsulation material surrounding said lead frame, said semiconductor component and said insert.
2. A semiconductor package according to claim 1 , further comprising a seal for attaching said insert to the front face of said semiconductor component, said seal forming a spacer therebetween.
3. A semiconductor package according to claim 1 , further comprising a layer of adhesive for attaching said insert to the front face of said semiconductor component.
4. A semiconductor package according to claim 1 , wherein said plug is transparent.
5. A semiconductor package according to claim 1 , wherein said insert has a slot in an outer surface thereof.
6. A semiconductor package according to claim 1 , wherein said lead frame comprises:
a platform for mounting said semiconductor component; and
at least one electrical connection lead extending outwardly from said body of encapsulating material.
7. A semiconductor package according to claim 1 , wherein said lead frame comprise a mounting and electrical connection plate.
8. A semiconductor package according to claim 7 , wherein said body of encapsulating material extends at least in front of said plate.
9. A semiconductor package comprising:
a mounting plate;
a semiconductor component having front and rear surfaces and comprising a sensor, the rear surface attached to said mounting plate and the front surface attached to said sensor;
an insert spaced apart from the front face of said semiconductor component and said sensor, said insert having an access passage for exposing said sensor;
a plug positioned within a portion of the access passage of said insert;
a seal for attaching said insert to the front face of said semiconductor component and forming a spacer therebetween; and
a body of encapsulation material surrounding said mounting plate, said semiconductor component and said insert.
10. A semiconductor package according to claim 9 , wherein said plug is transparent.
11. A semiconductor package according to claim 9 , wherein said insert has a slot in an outer surface thereof.
12. A semiconductor package according to claim 9 , wherein said mounting plate comprises:
a platform for mounting said semiconductor component; and
at least one electrical connection lead extending outwardly from said body of encapsulating material.
13. A semiconductor package comprising:
a mounting plate;
a semiconductor component having front and rear surfaces and comprising a sensor, the rear surface being attached to said mounting plate and the front surface being attached to said sensor;
an insert attached to the front face of said semiconductor component, said insert having an access passage for exposing said sensor;
a plug positioned within a portion of the access passage of said insert; and
a body of encapsulation material surrounding said mounting plate, said semiconductor component and said insert.
14. A semiconductor package according to claim 13 , wherein said plug is transparent.
15. A semiconductor package according to claim 13 , wherein said insert has a slot in an outer surface thereof.
16. A semiconductor package according to claim 13 , wherein said mounting plate comprises:
a platform for mounting said semiconductor component; and
at least one electrical connection lead extending outwardly from said body of encapsulating material.
17. A semiconductor package according to claim 16 , wherein said body of encapsulating material extends at least in front of said platform.
18. A semiconductor package according to claim 13 , wherein said mounting plate comprises a mounting and electrical connection plate.